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Senior Optical Packaging Engineer

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Human Interface Business Unit islooking for an Optical Packaging Engineer that will focus on advancedpackaging technology development that will go into cutting edgeconsumer and automotive products. Working closely withTechnology R&D and QA groups you will be responsible for doingproof of concept, feasibility and DOE to develop and optimize thepackaging processes with maximized manufacturing yield, electricaland optical performance and package reliability. A thoroughunderstanding of the complete system development, production, andtesting process as well as making sound engineering decisions is amust.

Responsibilities

  • Work with cross-functional teams to developprocesses, packages and modules for our optical sensors and humaninterface products.
  • Develop new materials and assemblyprocesses for Optical Sensors as well as Optical System in Packageproducts that go into consumer, automotive and industrialproducts.
  • Develop proven validation correlation of newtechniques including opto-mechanical, and thermal stresssimulations.
  • Ability to apply well defined Design ofExperiment and ability to analyze data and draw decisions.
  • Conduct failure analysis, materials characterization, and surface andinterface analysis.
  • Conduct competitive benchmarking inpackage designs and materials.
  • Design-for-manufacturabilityand design-for-reliability.
  • Interact with internal andexternal customers, subcontractors and equipment and materialsuppliers.
  • Ability to clearly communicate with customers andsubcontractors.
  • Must be able to work across functionalboundaries to gather information needed to understand problems,ability to leverage teams and motivate a team environment.
  • Create intellectual properties.

  • Requirements


  • Masters of Science and/or PhD inMaterials Science & Engineering, Mechanical Engineering, Chemicalengineering, Physics and Electrical Engineering.
  • Knowledge ofoptical surface mount technologies and assembly processes.
  • Knowledge of assembly and processes for flip chip, CSP, and SiP.- Strong engineering background of optical properties of materialsand optical system design.
  • Familiar with package design rulesand thermal/electrical modeling tools. A background in opticalsimulation tools a plus.
  • Familiar with 3D CAD / Opticsprograms such as Solid Works, ACAD, ZMax, FRED.
  • Good problemsolving, effective communication and presentation skills.
  • Strong fundamentals in the fields of Applied Physics and materialsselection methodologies.
  • Strong engineering fundamentals andstatistical skills.
  • Proven innovator with an ability tosimplify concepts and present ideas clearly to a diverse audience.- Organize information and data that can be used to draw usableengineering conclusion and decisions.
  • Strong programmanagement skills in achieving time to market on projects.
  • Being able to operate in high priority-high pressure projects thathave close deadlines.
  • Hands-on knowledge of packagereliability requirements, failure analysis techniques and assemblyprocess issues.
  • Thorough experience in the SMT process andrework methodologies preferred.
  • FEA/mechanical modelingexperience is a plus.
  • 7-10 years of experience in opticalpackaging field. Experience in Consumer solutions is aplus.

    Maxim is an EEO/AA Employer


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